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16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
A Microchip Technology Company
SST39VF1602 / SST39VF3202
Not Recommended for New Designs
Table 19: Revision History
Number
Description
Date
00
01
?
?
Initial release
Corrected Pin 15 from A20 to NC for SST39VF160x in Figure 2 on
Mar 2003
Apr 2003
page 4
02
03
04
?
?
?
?
?
Changed data sheet title
2004 Data Book
Updated the B3K and B1K package diagrams
Added non-Pb MPNs and removed footnote. (See page 31)
Added RoHS compliance information on page 1 and in the “Product
Jun 2003
Nov 2003
Nov 2005
Ordering Information” on page 30
?
?
Corrected the solder temperature profile in “Absolute Maximum Stress
Ratings” on page 15
Changed product status from “Preliminary Specifications” to “Data
Sheet”
05
A
?
?
?
?
?
?
?
Removed 90 ns Read Access Time globally
EOLed all lead (Pb) valid combinations. See S71223(02)
EOLed SST39VF6401 and SST39VF6402. See S71223(03)
Changed document status to “Not Recommended for New Designs”
Applied new document format
Released document under letter revision system
Updated Spec number from S71223 to DS25028
June 2008
Aug 2011
ISBN:978-1-61341-355-5
? 2011 Silicon Storage Technology, Inc–a Microchip Technology Company. All rights reserved.
SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Tech-
nology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and
registered trademarks mentioned herein are the property of their respective owners.
Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current
package drawings, please see the Packaging Specification located at http://www.microchip.com/packaging.
Memory sizes denote raw storage capacity; actual usable capacity may be less.
SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of
Sale.
For sales office locations and information, please see www.microchip.com.
Silicon Storage Technology, Inc.
A Microchip Technology Company
www.microchip.com
?2011 Silicon Storage Technology, Inc.
34
DS25028A
08/11
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相关PDF资料
SST39VF3201B-70-4C-B3KE IC FLASH MPF 32MBIT 70NS 48TFBGA
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相关代理商/技术参数
SST39VF3201704IEKE 制造商:Microchip Technology Inc 功能描述:
SST39VF3201-70-4I-EKE 功能描述:闪存 2M X 16 70ns RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF3201-70-4I-EKE-T 功能描述:闪存 2.7 to 3.6V 32Mbit Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF3201B-70-4C-B3KE 功能描述:闪存 32M (2Mx16) 70ns 2.7-3.6V Commercial RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF3201B704CEKE 制造商:Microchip Technology Inc 功能描述:
SST39VF3201B-70-4C-EKE 功能描述:闪存 32M (2Mx16) 70ns 2.7-3.6V Commercial RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF3201B-70-4I-B3KE 功能描述:闪存 2.7 to 3.6V 32Mbit Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF3201B-70-4I-B3KE-T 功能描述:闪存 2.7V to 3.6V 32Mbit Multi-Prps Fl RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel